
Semiconductor CNC Machining
Semiconductor CNC Machining
Product Introduction
Semiconductor cnc machining demands strict control over cleanliness, dimensional accuracy, and surface quality. We provide custom-machined parts for semiconductor equipment to meet vacuum, sealing, and high-precision assembly requirements.
Performance And Specifications
With 20 CNC machining centers, including 19 four-axis machines, we can process aluminum alloy, stainless steel, engineering plastics, and other materials commonly used in semiconductor equipment. Standard precision machining tolerance can be controlled within ±0.05 mm, while critical sealing surfaces and mounting holes can be further controlled to ±0.025 mm. Surface roughness can reach Ra0.8 μm, making these parts suitable for vacuum chambers, trays, and high-cleanliness assembly components.
Applications
Suitable for semiconductor equipment parts such as vacuum chambers, gas distribution plates, wafer trays, robotic arm fixtures, and testing jigs.
R&D Support and Sample Testing
We support non-standard customization, drawing evaluation, and sample testing, and can provide reference cases for similar projects based on customer requirements.
Full Project Tracking Before and During Production
From initial communication to production execution, we can provide synchronized updates on technical evaluation, machining progress, and delivery milestones, making it easier for overseas customers to track their orders.
Factory Equipment and Dedicated Team
With complete equipment and a professional technical team, we can support both low-volume prototyping and batch production of complex semiconductor components.
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